Processor cooling
New challenges posed by Advanced TCA
When it comes to high-performance processors in AdvancedTCA (Advanced Telecom Computing Architecture) systems, air-based cooling systems are already reaching the limits of their capabilities. Boards produce a heat loss of up to 200 W per slot, and a fully configured system with 16 slots can produce in excess of 3 kW. With rising integration densities and clock frequencies, even greater heat losses in ever more confined spaces are to be expected in future.
The solution: Liquid-based CPU cooling
With a new infrastructure solution for ATCA shelves, Rittal now offers a high-performance, liquid-based CPU cooling system which reliably dissipates the heat loss directly at the hotspot.
The handling of the fluid connections is as simple as plugging in modern electronics. When the card is inserted, board cooling is automatically integrated into the cooling circuit. A high level of safety is guaranteed, thanks to comprehensive liquid monitoring. The flow, setpoint and actual temperatures may optionally be monitored via the Rittal CMC-TC, to ensure maxium operational reliability and availability of the entire system.
Rittal offers a complete infrastructure, from CPU cooling and distribution, via monitoring, through to recooling, with many years of practical use at enclosure level behind it.
